Hanxin provides a comprehensive range of lapping and polishing plates designed for virtually any application. Typical options include:
· Cast Iron – General Engineering
· Hardened Steel – Rough Lapping
· Ceramic – Hard Materials and Ceramics
· Glass – Electro-Optic Applications
· Aluminum / Stainless Steel – Pad Polishing
· Natural Metals (Copper, Tin/Antimony, etc.) – Diamond Polishing
Beyond our standard OEM lapping plates, segments, and rings, we offer a fully custom “ALL BRANDS” service to meet any lapping requirement. All products are manufactured from premium cast iron or other specialty metals. Leveraging our advanced custom manufacturing capabilities, we can replicate or adapt plates, segments, and rings to your exact specifications, or provide alternative material composites such as copper, aluminum, or tin to suit specialized applications.
The choice of lapping plate material depends primarily on the material being processed, while the corrosive strength of the polishing slurry determines the appropriate pad polishing plate. More than 95% of materials are lapped using cast iron, with exceptions mainly in some semiconductor applications. Below is a summary of common lapping and polishing plate materials and guidance on their typical uses.
Casti iron lapping plates are the most widely used for lapping nearly all materials, with the exception of gallium arsenide semiconductors. Whenever possible, radial serrated plates should be used. Solid surface plates are only recommended in two cases:
1. Small components that could catch or fall into serrations.
2. Hard diamond polishing processes without a polishing pad, where serrations may scratch precision components.
Serrations on the surface of a lapping plate serve multiple purposes:
1. Reduce Surface Tension:
During lapping, as the component contour begins to match the lapping plate, a strong attraction develops between the surfaces. This can make it very difficult to lift the component, preventing abrasive slurry from flowing underneath and slowing or halting material removal. The serrations act as an air gap, allowing the component to float on the slurry layer, minimizing surface tension and promoting efficient stock removal.
2. Remove Swarf:
Serrations help remove swarf from the plate surface. Swarf consists of crushed abrasive, component material, lapping plate, conditioning ring material, and excess vehicle.
A common question is: “Which serration pattern is best?” The answer is: the pattern that works best for your specific application. Hanxin research has shown that different serration patterns and densities have minimal measurable impact on stock removal rates or plate flatness during standard single-side lapping. However, radial serrations deliver optimal performance at the most economical cost, which is why they are recommended as the standard choice.
Ideal for non-corrosive soft polishing applications, aluminum plates are designed to work with fabric-like polishing pads bonded to the plate surface using pressure-sensitive adhesive. The precision-lapped flat surface ensures the pad conforms perfectly, providing consistent results. No serrations are present, as they are unnecessary for soft pad polishing.
Used for soft pad polishing with corrosive slurries, stainless steel plates offer superior chemical resistance. Due to their high cost, they are recommended only when aluminum or ceramic plates are unsuitable.
Designed for hard ceramic components, such as white alumina, ceramic plates enable diamond polishing and precision lapping. While cast iron can be used for ceramic lapping, it may cause gray discoloration or impregnation, depending on the ceramic’s density. For maintaining a clean, white appearance, ceramic plates are the optimal choice. No serrations are ground into the surface, as serrations could negatively affect polishing performance. Serrations would only be considered if cost-effective without compromising quality.
Soda-lime glass plates are specially designed for lapping delicate semiconductor materials, including gallium arsenide (GaAs), lithium niobate, and indium phosphide. Currently, these plates are used exclusively for such precision applications, as other uses have not been identified.
The surface of glass plates has no serrations, both due to the high cost of machining and because the materials processed are extremely delicate. This makes them ideal for scratch-sensitive semiconductors and compound semiconductor components, ensuring maximum surface integrity during polishing.
· Reduce or eliminate hydroplaning of parts/rings
· Usually enables faster stock removal
· Need to reduce vehicle or lubricant surface tension
· In-process swarf removal
· Help reduce time required to restore flatness
· Increase specific down pressure
· Expedite migration of slurry/lubricant
· Primarily used with small parts that may catch in grooves
· Suitable for parts with edge burrs or nicks
· Ideal for sensitive material types
· Recommended for applications with edge-chip sensitivity
· Compatible with most types of fixturing
· Small-sized part friendly
· Easy to clean
· Low material removal rates
· Glazes easily
· Produces less lustrous surface finish
· Rods, pins, plungers, ferrules
· Applications requiring thickness or perpendicularity fixtures
· Most common default groove pattern
· Creates sufficient surface interruption to optimize surface finish
· Most appropriate for free-abrasive machining
· Best non-staining/imaging pattern
· Excellent surface finish generation
· Inexpensive and easy-to-machine groove pattern
· Easy to clean quickly and effectively
· Material removal rates not optimized
· Potential for surface glazing
· Any solid material on a solid, stable platform
· Minimum diameter: ¼” (6.35 mm)
· Parts without major nicks or burrs
Also called cross-grid or “X-Y” groove
Most appropriate for conventional abrasive lapping (not free-abrasive machining)
Provides a stable platform between radial and spiral grooves
Effective balance of material removal rate and surface finish
Can be modified to reduce land mass for higher material removal
Expensive to manufacture
Difficult to clean thoroughly
Small edge corners may break off and scratch
All non-free abrasive machining applications listed for radial-groove plates
· Single continuous groove; can run clockwise (CW) or counter-clockwise (CCW) to hold liquids or allow auto-drain
· Groove depth is normally shallow; suitable for fine pattern micro-texturing
· Primarily used for “rough” or primary polishing
· Normally applied to larger flat, stable parts
· Relatively easy to machine and re-machine
· Excellent material removal rates
· Flexible groove design allows adjustment of land areas to increase removal or improve surface finish
· Wall and bottom contours are critical
Negative Attributes
· Except in micro-texture version, edges fracture easily and may generate scratches
· Difficult to clean thoroughly
· Requires high pressure
· Pattern may cause staining or imprinting
· For applications requiring a plate that remains wet and does not need continuous evacuation of spent material
· Most commonly used for hand lapping or polishing
· Maintains flatness for longer periods
· Retains wetting for extended time
· Wall and bottom contours are critical
· Expensive and difficult to machine
· Difficult to clean
· Edge chipping is a constant concern
· Not designed for use on lapping machines
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